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Turnkey Thermal Imaging Module – TCM10K25D

Turnkey Thermal Imaging Module – TCM10K25D
Turnkey Thermal Imaging Module – TCM10K25D
Turnkey Thermal Imaging Module – TCM10K25D
New
Turnkey Thermal Imaging Module – TCM10K25D
Turnkey Thermal Imaging Module – TCM10K25D
Turnkey Thermal Imaging Module – TCM10K25D
Turnkey Thermal Imaging Module – TCM10K25D
from
$180.0
税抜き: $180.0
10 以上 $140.0
50 以上 $120.0
200 以上 $100.0
1000 以上 $85.0
  • Stock: In Stock
  • Model: TCM10K25D

利用可能なオプション

 

The TCM10K25D infrared thermal camera module is a compact 120×90 uncooled imaging solution designed for ultra-low-power applications. Despite its miniature size, it integrates a highly sensitive VOx infrared detector and a new image-processing engine that delivers stable thermal imaging even in challenging environments such as night, strong light, low light, fog, smoke, light rain, snow, or haze.

Its lightweight design makes it ideal for embedded systems, consumer devices, and low-cost integrator applications. The module also supports customizable FOV lens options, allowing flexibility for different usage scenarios.

 


Technical Information

 Product ID TCM10K25D
 Sensor WLP VOx uncooled detector
 Spectral Band 8μm ~ 14μm
 Image Pixels & Resolution 120(W) × 90(H)
 Pixel Pitch 17μm
 Frame Rate 25fps @ 120×90
 Thermal Sensitivity (NETD) ≤60mK @ 25°C
 Data Interface SPI / DVP
 Measuring Range Industrial:
-20°C ~ +150°C, +100°C ~ +400°C (low gain)
 Operating Temperature -40°C ~ +70°C
 Operating Voltage DC 3.3V / 5V
 Power Consumption <45mW
 Dimensions 50° lens: 8.5mm × 8.5mm × 9.2mm
90° lens: 12mm × 10mm × 5.6mm
 Weight ≈2g
 Lens Options(FOV) 50° / 90°

Disclaimer: Product images and specifications are for reference only and may be updated without prior notice. Please contact us for the latest information.